SANTA CLARA, California, September 10, 2021 / PRNewswire / – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in infrastructure semiconductor solutions, announced that the September 9, 2021 he launched an exchange offer (the “Exchange offer“) certain of the Company’s unregistered notes in circulation for new registered notes.
As part of the exchange offer, the Company proposes to exchange up to (i) a total principal amount of $ 500,000,000 of new 1.650% senior bonds maturing in 2026, (ii) a total principal amount of $ 750,000,000 of new 2.450% senior bonds due 2028, and (iii) $ 750,000,000 total principal amount of new 2.950% senior bonds due 2031 (collectively, the “Exchange of Notes“), the issue of which has been registered under the Securities Act of 1933, as amended (the”Securities Act“), for a similar principal amount of its (i) $ 500,000,000 in total principal of its outstanding 1.650% senior notes due 2026, (ii) $ 750,000,000 in total principal of its outstanding 2.450% senior outstanding due 2028, and (iii) $ 750,000,000 aggregate principal of its 2.950% senior obligations due 2031 (collectively, the “Exceptional NotesThe terms of the Exchange Notes offered in the Exchange Offer are substantially identical to the terms of the respective series of Notes outstanding, except that the Exchange Notes will be registered under the Securities Act. , and certain transfer restrictions, registration fees, and additional interest provisions relating to outstanding Notes will not apply to Exchange Notes.
The purpose of the Exchange Offer is to fulfill the obligations of the Company under the applicable registration rights contract entered into in connection with the issue of the outstanding Notes. The Company will not receive any proceeds from the Exchange Offer.
The exchange offer will expire at 5:00 p.m. New York time on October 7, 2021, unless extended (date and time, which may be extended on “Expiration date“). The settlement date of the Exchange Offer will be promptly after the Expiration Date. The terms of the Exchange Offer and other information relating to the Company are set out in a prospectus dated 9 September 2021 (the “prospectus“), a copy of which has been filed with the Securities and Exchange Commission (the”SECONDThe Company has not authorized anyone to provide information other than that set forth in the prospectus.
Copies of the prospectus may be obtained from the exchange agent, Global Bondholder Services Corporation, by telephone at (212) 430-3774 or toll free at (866) 470-3800, by writing by ordinary or certified mail, or by night courier, to Global Bondholder Services Corporation, Attention: Corporate Actions, 65 Broadway – Suite 404, New York, new York 10006.
This press release is provided for informational purposes only and does not constitute an offer to exchange or sell, nor a solicitation of an offer to purchase or exchange any exchange tickets. The Exchange Offer is being made only under the prospectus dated September 9, 2021, including any supplements. The exchange offer is not made to holders of any jurisdiction in which the achievement or acceptance thereof would not comply with securities laws, blue sky or other laws of that jurisdiction. jurisdiction.
This press release does not constitute an offer to purchase or exchange securities or the solicitation of an offer to purchase or exchange securities or an invitation to participate in the Exchange Offer in any jurisdiction in which, or to any person to or from whom, it is illegal to make such invitation or for such participation to take place under applicable securities laws. The distribution of this press release in certain jurisdictions may be restricted by law. Persons in possession of this press release or the prospectus are required to inform themselves and to comply with these restrictions.
To deliver the data infrastructure technology that connects the world, we build solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world’s largest technology companies for 25 years, we move, store, process and secure the world’s data with semiconductor solutions designed for the current needs and future ambitions of our customers. Through a deep collaboration and transparency process, we are ultimately changing the way the enterprise, cloud, automotive and carrier architectures of tomorrow are transforming, for the better.
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Vice-President, Investor Relations